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Metallographic Laboratory Services


Horizontal cross-section of PWB Plated through hole

 

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  • Qualification and Quality Conformance Inspections to
    MIL-PRF-55110, and IPC-6012
  • Surface Insulation Resistance (SIR) Testing
  • Qualification to MIL-I-46058 and IPC-CC-830
  • IPC-SM-840
  • Ball Grid Array Solder Joint Reliability
  • Thermal Cycling and Thermal Shock
  • Mechanical Deflection
  • Data acquisition systems for continuous resistance monitoring during thermal cycling, thermal shock and SIR Testing

 

Delsen has long been a leader in the evaluation of printed boards and related materials for the electronics industry. Our activity in IPC test methods and standards development assures that we are abreast of the latest techniques in this rapidly changing industry. Our metallographic cross-sectioning of printed boards may be the finest anywhere, and we often are selected as a referee laboratory for the evaluation of high reliability electronics. Delsen also specializes in reliability tests such as thermal cycling, thermal shock and torsional cycling. During these tests, coupons may be monitored continuously for resistance change, using a multi-channel data acquisition system.

Surface Insulation Resistance (SIR) testing is used to evaluate materials and processes for cleanliness. Delsen dedicates special chambers to these tests to ensure precise humidity control. Continuous data acquisition makes certain that critical events, such as dendritic growth, will be observed.

All Projects include a complete and accurate Test Report.

PWB

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1024 Grand Central Avenue
Glendale, CA 91201
888-433-5736
Fax: 818-247-4537
info@delsen.com

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